Download Handbook of Thin Film Deposition Processes and Techniques. by Krisna Seshan (Eds.) PDF

By Krisna Seshan (Eds.)

Content material:
Foreword

, Pages ix-x, Gordon E. Moore
Preface to the second one Edition

, Pages xi-xii, Krishna Seshan
Preface to the 1st Edition

, Pages xiii-xiv, Klaus okay. Schuegraf
Contributors

, Pages xv-xvi
Recent adjustments within the Semiconductor Industry

, Pages 1-9, Krishna Seshan
1 - Deposition applied sciences and purposes: advent and Overview

, Pages 11-43, Werner Kern, Klaus okay. Schuegraf
2 - Silicon Epitaxy by means of Chemical Vapor Deposition

, Pages 45-110, Martin L. Hammond
3 - Chemical Vapor Deposition of Silicon Dioxide Films

, Pages 111-150, John Foggiato
4 - steel natural Chemical Vapor Deposition: expertise and Equipment

, Pages 151-203, John L. Zilko
5 - function Scale Modeling

, Pages 205-240, Vivek Singh
6 - The function Of Metrology And Inspection In Semiconductor Processing

, Pages 241-286, Mark Keefer, Rebecca Pinto, Cheri Dennison, James Turlo
7 - illness regulate, illness Detection, and Yield Enhancement in Gigabit Manufacturing

, Pages 287-318, Suresh Bhat, Krishna Seshan
8 - Sputtering and Sputter Deposition

, Pages 319-348, Stephen Rossnagel
9 - Laser and Electron Beam Assisted Processing

, Pages 349-379, Cameron A. Moore, Zeng-qi Yu, Lance R. Thompson, George J. Collins
10 - Molecular Beam Epitaxy: apparatus and Practice

, Pages 381-461, Walter S. Knodle, Robert Chow
11 - Ion Beam Deposition

, Pages 463-499, John R. McNeil, James J. McNally, Paul D. Reader
12 - Chemical Mechanical Polishing

, Pages 501-512, Kenneth C. Cadien
13 - natural Dielectrics in Multilevel Metallization of built-in Circuits

, Pages 513-593, Krishna Seshan, Dominic J. Schepis, Laura B. Rothman
14 - functionality, Processing, and Lithography Trends

, Pages 595-607, Krishna Seshan
Index

, Pages 609-629

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Extra resources for Handbook of Thin Film Deposition Processes and Techniques. Principles, Methods, Equipment and Applicatios

Sample text

Electrophoretic coating is based on deposition of a film from a dispersion of colloidal particles onto a conductive substrate. The dispersion in a conductive liquid dissociates into negatively charged colloidal particles and positive ions (cations), or the reverse. On application of an electric field between the positive substrate electrode (anode), the colloidal particles migrate to the substrate, become discharged, and form a film. Chemical or electrochemical treatments of a metal surface can produce a thin and adherent layer on that metal.

Heteroepitaxy growth in which the epitaxial layer is a different material from the substrate. Virtually all commercial silicon epitaxy is homoepitaxy, with the exception of silicon-on-sapphire. Epitaxial silicon layers can be created by a wide range of techniques, including evaporation, sputtering, molecular beams, and various 45 46 Thin-Film Deposition Processes and Technologies � regrowth concepts. [1][2] Chemical vapor deposition is the formation of stable solids by decomposition of gaseous chemicals using heat, plasma, ultraviolet, or other energy sources, or a combination of sources.

Only the future outlook for the requirements and applications of such equipment is discussed in the following chapters in this book. The deposition equipment for the research and development of new device structures has to meet, in general, quite different requirements than the equipment used in the manufacturing of devices on a large scale. Research and development equipment requires a high degree of flexibility in deposition parameters, in accommodation of a variety of substrates, and in process monitoring equipment.

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